NGi

Overview of the Technology supported by our Foundry partners

Process Technology	Description
BCD CMOS	0.13µm, 0.18µm, 0.35µm Up to 120V	Embedded NVM 900V UHV
Analog & Mixed Signal	0.18µm Up to 30V	Low Noise Components Single gate oxide
Power Discrete	Low Voltage / High Voltage MOSFET	IGBT, SiC, GaN (all in development)
eNVM	OTP MTP	SRAM/ROM

Main packaging solutions being offered by our partner suppliers

Package Family	Description
Wafer Level CSP	1P1M Bump on Pad. Low-cost solution.
	2P1M Bump on RDL without UBM.
	2P2M Bump on RDL with UBM. Widely used structure.
	3P3M Dual RDL.
Copper Pillar Bump	1M Bump on pad without re-passivation
	1P1M Bump on pad with re-passivation
	1P2M Bump with RDL
	1P2M Bump with RDL and micro via
	2P2M Bump with RDL
BGA/LGA	Body size range from 3mm x 3mm up to 12mm x 12mm Ball pitch of 0.4mm, 0.5mm and 0.65mm are available Typical package thickness range 0.8mm to 1.4mm Au or Cu wire, substrate with 2 or 4 layers, Single-die, multi-die, stacked-die.
QFN/DFN	Package thickness range from 0.35mm to 0.85mm Body size available from 1mm x 1mm to 14mm x 14mm Single-die, multi-die, stacked-die. Wettable flank, Chip-on-Lead (COL), Au or Cu wire options
QFP	From 1mm to 3mm package thickness. Body size available from 7mm x 7mm to 28mm x 28mm Single-die, multi-die, stacked-die Au or Cu wire options
TO, SOT, SOIC, SSOP, TSSOP	A wide range of different options
Flip-Chip with Copper Pillar Bump	Available in QFN, DFN, SOP and TSOT
High Power CSP	Copper pillar bump size up to 150mm x 750mm aspect ratio

Our test development services cover wafer probe and package final testing, ranging from new silicon verification, device characterization, test program optimization, conversion to other test platform and transfer from engineering activity to mass production.

The team works with 3rd party partners to provide cost-effective solutions for analog, digital, RF and mixed signal devices.

From device prototype to production release stage, we provide a wide range of product engineering services.

Manufacturing flow definition
Product cost analysis
Backend assembly BOM and Process qualification
Device characterization
Yield analysis, improvement and management
Product cost reduction review and execution
Yield Management System (YMS) using our own low-cost YMS tool

Producing a product with built-in quality and reliability is the center of our focus. The services being offered encompass NPI and initial production run. We use labs in the Bay Area and Asia for some of those services.

QMS, Certification & Audit

QMS solution definition and development
DMS solution definition and development
Prepare for audit and certification
Product certification

Quality and Reliability Control

On-going Reliability Monitoring
SYL/SBL Monitor and Maverick Lot Control
Change Control
Non-conforming Material Control
Manufacturing Data Monitor and Control

Product & Process Qualification

Qualification Test Plan definition for NPI
Product/Device Qualification
Package Qualification
Backend assembly process optimization and qualification

We can help you navigate through the early phase of production with low-volume production (LVP) support.

We work with our local and offshore partners to provide manufacturing operations and support to cater and satisfy your early production requirements. Our experienced team provides the following skillset.

Supplier Management
Production Planning
Purchasing
Logistics

Manufacturing Service